Toshiba Expands CMOS Image Sensor Product Lineup With 2-Megapixel CMOS Image Sensor Chip
New CMOS Image Sensor Provides High-End Camera Phone Users With Great Visual Experience, Even in Low-Light Conditions
SAN FRANCISCO, March 7 /PRNewswire/ -- Toshiba America Electronic Components, Inc. (TAEC)* today announced the availability of a new 2-megapixel CMOS image sensor chip targeted at high-end camera-enabled mobile handset applications, including Smartphones. Designated ET8EA3-AS, the new chip has a small 3.3 micron (um) x 3.3um pixel size with a 1/2.7-inch optical format and incorporates an analog-to-digital (A/D) converter. TAEC will be showing working samples at the Embedded Systems Conference here this week.
"With the launch of our new 2-megapixel ET8EA3-AS CMOS image sensor, Toshiba can support the higher-resolution camera requirements of cell phone manufacturers," said Andrew Burt, director of the Wireless Business Unit at TAEC. "We believe camera phones will start to compete effectively with low- end digital still cameras at the 2-megapixel level. We expect our new device will accelerate that trend and reinforce Toshiba's CMOS imaging leadership." He noted that Toshiba CMOS image sensors have proven their superiority in image quality comparisons by offering demonstrably better color balance and picture quality, even in dark-light conditions.
Key Features
The ET8EA3-AS CMOS image sensor is an area color image sensor that incorporates an A/D converter in non-diced wafer form; key features include the following:
* Adoption of a square pixel, each 3.3 x 3.3um, achieves approximately
2 megapixels of array resolution in a 1632 horizontal by 1216 vertical
array with a 1/2.7-inch optical format
* Capable of up to 15 frame-per-second (fps) operation for full-resolution
output
* Achieves low-power consumption engendered by Toshiba's renowned CMOS
process technology
* Toshiba's advanced sensor technology and sophisticated signal processing
technology result in excellent picture quality
* Can use with a companion Toshiba DSP chip that provides YUV or JPEG
encoded data or employ another suitable external DSP chip
Toshiba CMOS Image Sensor Product Line
Cell phones, including the new Smartphones, increasingly incorporate built-in video- and still-image capabilities. CMOS image sensors are widely used in such products as they enjoy advantages in small size and low-power consumption compared to CCDs. Toshiba's CMOS image sensors employ a special square pixel design that enables them to achieve CCD-quality images with low-power consumption, even in low-light conditions. Recognized for its excellence in CMOS imaging, Toshiba currently offers the TCM8230MD VGA camera module, the TCM8240MD 1.31-megapixel camera module and the new ET8EA3-AS 2-megapixel CMOS image sensor chip. 3.2-megapixel chips are under development at Toshiba.
Pricing and Availability
Samples of the ET8EA3-AS are currently available with mass production planned for June, 2005. Pricing is $25.00 each in 10,000-piece quantities.
Technical Specification Summary
Part Number ET8EA3-AS
Optical Format 1/2.7 inch
Output Pixel 1632 (H) x 1216 (V)
Numbers
Pixel Size Square pixel: 3.3um (H) x 3.3um (V)
Image Size 5.386mm (H) x 4.013mm (V)
Scanning Progressive-scanning
Color Filter RGB primary color filter, Bayer arrangement
Output Data RAW data, 12-bit parallel
External Clock 6 to 20MHz, including phase-locked loop
Frequency Range
Frame Rate 15 frames per second (fps)/7.5fps @ UXGA output
30fps/15fps/7.5fps @ SVGA output
Interface Control I(2)C bus
Power Supply 2.8 +/- 0.2 Volts (V) or 1.5 +/- 0.1V
Power Consumption 2.8V: 20mA (typical) at 30fps
1.5V: 60mA (typical) at 30fps
Operating -20 degrees - 60 degrees C
Temperature
Functionality Automatic blemish detection and correction, lens
shading compensation, variable electronic shutter,
variable gain control, built-in feedback clamp
Package Non-diced wafer
*About TAEC
Combining quality and flexibility with design engineering expertise, TAEC brings a breadth of advanced, next-generation technologies to its customers. This broad offering includes semiconductors, flash memory-based storage solutions, and displays for the computing, wireless, networking, automotive and digital consumer markets.
TAEC is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, one of the five largest semiconductor companies worldwide in terms of global sales for the year 2003 according to Gartner/Dataquest's Worldwide Semiconductor Market Share Ranking. Toshiba is a world leader in high-technology products with more than 300 major subsidiaries and affiliates worldwide. For additional company and product information, please visit TAEC's website at chips.toshiba.com. For technical inquiries, please e-mail Tech.Questions@taec.toshiba.com.
Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications. In developing designs, please ensure that Toshiba products are used within specified operating ranges as set forth in the most recent Toshiba product specifications and the information set forth in Toshiba's "Handling Guide for Semiconductor Devices," or "Toshiba Semiconductor Reliability Handbook." This information is available at http://www.chips.toshiba.com/, or from your TAEC representative.
All trademarks and tradenames used herein are the properties of their respective holders.
CONTACT: Judy Kahn, +1-650-948-8881, judith.kahn@comcast.net, for TAEC;
or Deborah Chalmers of Toshiba America Electronic Components, Inc.,
+1-408-526-2454, deborah.chalmers@taec.toshiba.com
Web site: http://www.toshiba.com/taec
Web site: http://www.chips.toshiba.com/
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